Company introductionhttp://www.benanos.com/
Business item(s)
C2100 Dual Camera Structured Light 3D Vision Module
Since its launch in 2020, The C2100 has received widespread acclaim. It offers an incredibly affordable price without compromising on the quality comparable to high-end products from European and American makers. With dual 1MP cameras and a color structured light module, users can easily obtain color 3D point cloud images for robot guidance or convert them into depth images for AOI (Automated Optical Inspection) operations. The C2100 series currently includes models such as C2100-050E, C2100-200E, C2100-300E, and C2100-400E, and all of which communicate via Ethernet cable.
T2500 Telecentric Structured Light 3D Vision Module
The T2500 utilizes a 5MP camera paired with telecentric lens and two sets of color structured light modules. It provides high-precision 3D surface scanning at a 1um level, all at a price comparable to line scanning laser modules. The T2500 is designed for various vertical inspection applications, including PCBA, BGA, LGA, connectors, chips, castings, and injection-molded parts. It offers users 2D and 2.5D images, and even supports external light sources, allowing for versatile usage in different scenarios.
Introduction of the In-tray Inspection Solution
The In-tray Inspection Solution is a product designed specifically for tray-in/tray-out packaging equipment. This solution can detect chips as small as 2 x 2mm within the tray, distinguishing between single chips, stacked chips, and tilted chips, which may pose risks to subsequent processes. The solution utilizes TCP/IP communication handshake and is compatible with most semiconductor equipments.
T4904-014A-CX Telecentric Structured Light Series
The T4904-014A-CX is the latest product from Benano in 2023, specifically designed for packaging appearance inspection equipment, especially for the needs of six-sided inspection equipment. The product specifications are on par with those of leading inspection equipment manufacturers worldwide, providing users with four structured lights to ensure the stability of 3D imaging. With a field of view of up to 70 x 70 mm, users have the flexibility to capture large chips or multiple chips in a single shot. The latest CxP interface allows users to enjoy high-speed 3D imaging experiences, ensuring equipment UPH. Additionally, it supports customers in using custom external lights to meet special requirements.
