Utilizing the C2100 3D Vision Module, scan the 3D images of each slot in the tray to determine if each object is a single chip, stacked chips, or exhibiting abnormal conditions such as warping or rotation.

The packaging and testing facility aims to reduce chip damage caused by stacking and tilting during visual inspections. Therefore, they are seeking space to install the C2100 for their existing visual inspection equipment. This will allow them to capture images of the chips' appearance after they are loaded into the tray and scan the appearance of all the chips. The C2100 will communicate with the equipment's main control computer via TCP/IP to trigger the inspection and notify which chip positions in the tray have abnormal appearances that need to be avoided.