【2021 International Technical Webinar】 Full Speed Ahead for the New Generation of Vehicles - Future Technology Trends for EVs
Event Information
Agenda
Speaker information
Mr. Wen-Chia Wu
Hiwin Technologies Corp.
Director
Education： National Taiwan University Department of Mechanical Engineering Skill： (1) Product Development (2) Project Management (3) System Integration About -Graduated from the Solid Mechanics Division of the Department of Mechanical Engineering of National Taiwan University in 2004. -Joined HIWIN Technologies as product development engineer, developed linear motion components. -Deep knowledge of the application of motion systems. -Set up the Industrial Robotic Arm Department within HIWIN in 2011, engage in the technological development of automation and participate in numerous automated assembly line projects spanning automobile, PCB, semiconductors, metal processing, agriculture, etc.
Scott Huang
Techman Robot Inc.
COO
1995-1997 Contract Research Fellow at Industrial Technology Research Institute 1999- R&D Manager at Quanta Storage Inc. 2006- R&D Director at Quanta Storage Inc. 2012- GM of Intelligent Department at Quanta Storage Inc. 2016- Chief Operating Officer at Techman Robot -With R&D background of mechatronics at Quanta Storage, built Techman Robot from scratch. -Developed TM5, TM12, TM14 series products with the world-leading vision integration technology, making Techman Robot reach the second largest global market share in collaborative robots in only three years. -Strengthen Techman Robot’s existing products and optimize its key applications in smart manufacturing with software upgrades, such as AI and factory intelligence management system, leading it to become one of the top robotics companies in the world.
Jarry Chang
DFI Inc.
Chief Product Officer
Experience 2017- Senior PM Director at DFI Inc. 2015-2017 Senior R&D Director at DFI Inc. 2014-2015 Hardware R&D Director at DFI Inc. -Lead product planning from the aspect of key applications, work with the R&D team to achieve product differentiation in the rugged and AI fields, and develop a variety of innovative designs in the industry, including the smallest x86 motherboard and the wide temperature system, among which the product lines of systems and motherboards have been widely used in industrial automation and electric vehicles . -Currently focus on expanding the product portfolio in the fields of AIoT and 5G, develop products that can quickly adapt to real-world applications and meet the requirements of the rapidly changing market.
