Utilizing structured light from four directions to provide 3D imaging, coupled with central telecentric optics to offer multi-phase 2D imaging, it can be utilized for various vertical inspections involving 2D + 3D capabilities.

For customer equipment, there are typically multiple optical stations to address different inspection requirements. Usually, for the portion of the chip bottom side (SMT side), different inspection items are required for QFN/QFP/BGA, but generally, co-planarity and positional accuracy need to be confirmed. At this point, the T4904-014A-CX can perform a single scan, providing high-speed 2D + 3D imaging capabilities, allowing equipment manufacturers to reduce the need for additional stations and increase UPH.